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F. Testa, S. Tondini, F. Gambini, P. Velha, A. Bianchi, C. Kopp, M. Hofbauer, C. Manganelli, N. Zecevic, S. Faralli, G. Pares, R. Enne, A. Serrano, B. Goll, G. Fontana, A. Chalyan, J. Lee, P. Pintus, G. Chiaretti, H. Zimmermann, L. Pavesi, C. Oton, S. Stracca:
"Integrated Reconfigurable Silicon Photonics Switch Matrix in IRIS Project: Technological Achievements and Experimental Results";
Journal of Lightwave Technology, Vol. 37 (2019), No. 2; 345 - 355.

This paper reports the performances of a silicon photonics optical switch matrix fabricated by using large-scale threedimensional (3-D) integration. The wavelength selective optical switch consists of a photonic integrated circuit (PIC), with 1398
circuit elements, interconnected in a 3-D stack with its control electronic integrated circuit (EIC). Each PIC element can be trimmed or reconfigured by using metallic heaters. The EIC is designed to drive the heaters and to read the signal of monitor photodiodes integrated into the PIC. Small footprint and high energy efficiency are achieved in the PIC and the EIC. Automatic wavelength alignment of the optical circuits in the PIC to the ITU grid and fine temperature tuning of each photonic element to optimize the switch insertion losses are obtained by an optimization routine. A fully packaged switch with input/output fibers is tested both
for optical and electrical characteristics as well as for the system performances. Fiber-to-fiber insertion losses of about 20 dB and channel isolation of −35 dB are achieved. Bit error rate characteristics at 25 Gb/s are evaluated. Perspective applications of the optical switch in optical transport and intra-data center networks are discussed.

3-D photonic-electronic integration, colorless, directionless and contentionless (CDC) reconfigurable add and drop multiplexers (ROADM), integrated optical circuits, micro-ring resonator switch element, optical switches, photonic system-on-chip

http://dx.doi.org/10.1109/JLT.2018.2871974