Vorträge und Posterpräsentationen (mit Tagungsband-Eintrag):
N. Vokic, B. Schrenk, P. Müllner, B. Goll, D. Fowler, S. Jessenig, J. Kraft, M. Fournier, V. Muffato, R. Hainberger, K. Schneider-Hornstein, H. Zimmermann:
"3D-Integrated Transceiver for Optical Communications";
Vortrag: Austrochip 2018,
Graz;
27.09.2018; in: "26th Austrian Workshop on Microelectronics",
(2018),
ISBN: 978-1-5386-8200-5;
S. 44
- 49.
Kurzfassung englisch:
This paper presents an eight-channel optical transmitter and receiver circuit fabricated in 0.35 µm SiGe BiCMOS and integrated via inter-wafer connections to a photonic circuit fabricated in 220 nm SOI photonic technology in a 200 mm CMOS foundry. Measurement results demonstrate 8×1 Gb/s for transmitter and 8×10 Gb/s for the receiver. The transmitter“s extinction ratio is 5 dB. The receiver shows a sensitivity of -8.5 dBm at 10 Gb/s and a BER of 10-9, with a significant margin for improvement by optimizing the grating coupler efficiency, by a better fiber coupling, and to a lower extent by better matching the output impedance of the circuit.
Schlagworte:
optoelectronic integrated circuit, 3D integration optical transmitter, optical receiver, ring modulator, driver, photodetector, transimpedance amplifier
Erstellt aus der Publikationsdatenbank der Technischen Universität Wien.