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O. Huber, T. Faseth, G. Magerl, H. Arthaber:
"Dielectric Characterization of RF-Printed Circuit Board Materials by Microstrip Transmission Lines and Conductor-Backed Coplanar Waveguides Up to 110 GHz";
IEEE Transactions on Microwave Theory and Techniques, Vol. 66 (2018), No. 1; 237 - 244.

This paper introduces a method for determining the attenuation constant and the dielectric permittivity (Dk) by microstrip lines and/or conductor-backed coplanar waveguides. The method considers several effects (surface waves, frequency-dependent conductance, inductance, and resistance) for obtaining the attenuation constant of the line and the Dk of the substrate out of measurements. For the compensation of conductor properties, an easily applicable formula for any low loss transmission line is derived that avoids extensive simuilations. The validity of the method is shown by measurements of two RF-substrate materials up to 110 GHz. The resultig Dk not only shows excellent agreement with available data sheet values, but also extends the investigated frequency range.

Broadband material characterization, conductor-backed coplanar waveguides (CBCPW), copper loss, dielectric loss, dielectric materials, EM simulation, loss measurement, microstrip (MS), microwave propagation, quasi-TEM propagation

http://dx.doi.org/10.1109/TMTT.2017.2750152