Talks and Poster Presentations (with Proceedings-Entry):
O. Huber, T. Faseth, H. Arthaber, E. Schlaffer:
"Characterization of Printed Circuit Board Materials & Manufacturing Technologies for High Frequency Applications up to 110 GHz";
Talk: IEEE Wireless and Microwave Technology Conference,
Cocoa Beach, FL, USA;
04-13-2015
- 04-15-2015; in: "WAMICON 2015",
(2015),
ISBN: 978-1-4799-7521-1.
English abstract:
This paper focuses on the descrition of loss behavior up to 110 GHz for two commercially widely used trasmission line modes, microstrip (MS) and conductor backed coplanar waveguide (CBCPW). Within this investigation special attention has been drawn to the applied manufacturing processes as each process has distinct tolerances and etching behavior. The measured data is based on a comparison of 50 ω transmission lines manufactured on two different substrates and for two structuring processes, pattern plating and panel plating.
Keywords:
manufacturing technology, microwave circuits, passive circuits, microwave propagation, loss measurement, copper loss, dielectric loss
Created from the Publication Database of the Vienna University of Technology.